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NTMS4503N
Power MOSFET
28 V, 14 A, N?Channel, SOIC?8
Features
? Low R DS(on)
? High Power and Current Handling Capability
? Low Gate Charge
? Pb?Free Package is Available
Applications
? DC/DC Converters
? Motor Drives
? Synchronous Rectifier ? POL
? Buck Low?Side
V (BR)DSS
28 V
http://onsemi.com
R DS(on) Typ
7.0 m W @ 10 V
8.8 m W @ 4.5 V
D
I D Max
(Note 1)
14 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Rating
Drain?to?Source Voltage
Gate?to?Source Voltage ? Continuous
Drain Current
Continuous @ T A = 25 ° C (Note 1)
Continuous @ T A = 25 ° C (Note 2)
Continuous @ T A = 25 ° C (Note 3)
Single Pulse (tp = 10 m s)
Symbol
V DSS
V GS
I D
I DM
Value
28
$ 20
14
12
9.0
40
Unit
V
V
A
G
S
MARKING DIAGRAM &
PIN ASSIGNMENT
D D D D
Total Power Dissipation
T A = 25 ° C (Note 1)
T A = 25 ° C (Note 2)
T A = 25 ° C (Note 3)
Operating and Storage Temperature
P D
T J , T stg
2.5
1.66
0.93
?55 to
150
W
° C
8
1
SOIC?8
CASE 751
STYLE 12
8
1
4503N
AYWW G
G
Single Pulse Drain?to?Source Avalanche
Energy ? Starting T J = 25 ° C
(V DD = 30 V, V GS = 10 V, I L = 12.2 A,
L = 1.0 mH, R G = 25 W )
Maximum Lead Temperature for Soldering
Purposes, 1/8 ″ from case for 10 seconds
E AS
T L
75
260
mJ
° C
4503N
A
Y
WW
G
S S S G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb?Free Package
THERMAL RESISTANCE RATINGS
(Note: Microdot may be in either location)
Rating
Symbol
Value
Unit
Thermal Resistance
Junction?to?Ambient (Note 1)
Junction?to?Ambient (Note 2)
R q JA
50
75
° C/W
ORDERING INFORMATION
Device Package Shipping ?
Junction?to?Ambient (Note 3)
135
NTMS4503NR2
SOIC?8
2500/Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
NTMS4503NR2G
SOIC?8
(Pb?Free)
2500/Tape & Reel
Recommended Operating Conditions may affect device reliability.
1. Surface?mounted on FR4 board using minimum recommended pad size
(Cu area 0.412 in sq), t < 10 s.
2. Surface?mounted on FR4 board using 1 ″ pad size
(Cu area 1.127 in sq) steady state.
3. Surface?mounted on FR4 board using minimum recommended pad size
(Cu area 0.412 in sq), steady state.
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2007
March, 2007 ? Rev. 2
1
Publication Order Number:
NTMS4503N/D
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